Thin Film Deposition

Testing Capabilities

X-POWER offers deposition of thin films on wafers up to 100 mm or smaller sample pieces. Both sputtering (DC and RF) and e-beam deposition techniques are available in a cluster system with a load-lock and a robot for transfer of samples between units under vacuum.

The system is part of the prototyping capabilities in X-POWER where contacts from chips to external connections are investigated.

Potential to Research and Industry Service

• Support research on development of prototypes of new components
• Support research on contacts in power electronics
• Support research on development of packaging solutions

Key Figures of Thin Film Deposition System

• System base pressure: 10-9mbar
• Sample temperature: Room temperature to 1000 oC
• Sample size: From 1x1 cm2 to 100-mm wafer
• E-beam deposition: 8x12 cc pockets
• Sputtering: 3 Magnetrons, DC, RF, Bipolar