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AAU Energy

Rapid Thermal Annealing (RTA)

Testing Capabilities

X-POWER offers the possibility to anneal samples with very high heating and cooling rates under controlled atmospheres.

Vacuum and 4 gass lines (H₂, O₂, Ar, N₂)

Potential to Research and Industry Service

  • Support research on materials problems in electronic components.
  • Support research on contact formation in electronics.
Rapid Thermal Annealing (RTA)

The RTA System is used for

  • Implantation of impurities (doping)
  • Annealing of contacts
  • Wafer bonding

Key Figures of the RTA System

  • Prcise fast ramp up and down rates (20-kW IR lamps) – ramp up to 150 K/s
  • Maximum temperature 1200
  • Sample size: wafer size up to 100 mm