Rapid Thermal Annealing (RTA)

Testing Capabilities

X-POWER offers the possibility to anneal samples with very high heating and cooling rates under controlled atmospheres.

Vacuum and 4 gass lines (H₂, O₂, Ar, N₂)

Potential to Research and Industry Service

• Support research on materials problems in electronic components.
• Support research on contact formation in electronics.

The RTA System is used for

• Implantation of impurities (doping)
• Annealing of contacts
• Wafer bonding

Key Figures of the RTA System

• Prcise fast ramp up and down rates (20-kW IR lamps) – ramp up to 150 K/s
• Maximum temperature 1200
• Sample size: wafer size up to 100 mm