AAU Energy
Rapid Thermal Annealing (RTA)
Testing Capabilities
X-POWER offers the possibility to anneal samples with very high heating and cooling rates under controlled atmospheres.
Vacuum and 4 gass lines (H₂, O₂, Ar, N₂)
Potential to Research and Industry Service
- Support research on materials problems in electronic components.
- Support research on contact formation in electronics.
The RTA System is used for
- Implantation of impurities (doping)
- Annealing of contacts
- Wafer bonding
Key Figures of the RTA System
- Prcise fast ramp up and down rates (20-kW IR lamps) – ramp up to 150 K/s
- Maximum temperature 1200
- Sample size: wafer size up to 100 mm