Leica Sample Preparation System

Testing Capabilities

X-POWER offers preparation of cross sectional samples cut out from elements of power electronics.

The system consists of two separate units. In the TXP system, samples can be cut out with a diamond blade under a stereo microscope. After cutting, samples can be polished to a mirror like finish using a number of polishing pads. All processes can be programmed and stored. In the TIC3X system  final polishing using up to 3 ion beams under vacuum is carried out in order to remove damaged and strained layers from the surface. In order to allow preparation of surfaces of soft or porous materials, sample preparation may be performed under liquid nitrogen cooling. During processing, samples are mounted on holders that can be transferred between the systems.

After processing, the samples are ready for further inspection with SEM, optical microscopy or other characterization tools.

Key Figures of the Sample Preparation System

• Sample size up to 50x50x10 mm
• Cutting, milling, grinding and polishing
• Preparation of stress-free surfaces
• Cooling to -150oC for preparation of soft materials
• Location of cutting position under stereo microscope
• Automatic process control

Potential to Research and Industry Service

• Support research on materials problems in electronic components.
• Support research on degradation testing of components.
• Support research on development of prototypes of new components.